ChipletQuake: On-Die Digital Impedance Sensing for Chiplet and Interposer Verification
The increasing complexity and cost of manufacturing monolithic chips have driven the semiconductor industry toward chiplet-based designs, where smaller, modular chiplets are integrated onto a single interposer. While chiplet architectures offer significant advantages, such as improved yields, design...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-08-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/25/15/4861 |
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