Semiconductor Wafer Defect Recognition Based on Improved Coordinate Attention Mechanism

Semiconductor Wafer Defect Recognition Based on Improved Coordinate Attention Mechanism

In the semiconductor wafer manufacturing process, it is necessary to inspect the electrical parameters and functions of the wafer to identify the defects in the chip manufacturing process. The inspection results are presented in the form of wafers; therefore, the accuracy of wafer defect recognition...

Full description

Saved in:
Bibliographic Details
Main Authors: Hao He, Yuanjie Wei, Xionghao Lin, Minmin Zhu, Haizhong Zhang
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Access
Subjects:
Deep learning
improved coordinates attention mechanism
wafer defect inspection
lightweight network
multi-scale feature extraction
Online Access:https://ieeexplore.ieee.org/document/10908396/
Tags: Add Tag
No Tags, Be the first to tag this record!

Internet

https://ieeexplore.ieee.org/document/10908396/

Similar Items