Terminal Passivation–Induced Interface Decoupling for High‐Stability Two‐Dimensional Semiconductors

ABSTRACT Two‐dimensional (2D) materials, such as MoS2, show exceptional potential for next‐generation electronics. However, the poor stability of these materials, particularly under long‐term operations and high temperature, impedes their practical applications. Here, we develop a terminal passivati...

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Main Authors: Jinbo He, Jinjian Yan, Tao Xue, Liqian Yuan, Yongxu Hu, Zhongwu Wang, Xiaosong Chen, Yinan Huang, Cheng Han, Liqiang Li, Wenping Hu
Format: Article
Language:English
Published: Wiley 2025-04-01
Series:SmartMat
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Online Access:https://doi.org/10.1002/smm2.1318
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author Jinbo He
Jinjian Yan
Tao Xue
Liqian Yuan
Yongxu Hu
Zhongwu Wang
Xiaosong Chen
Yinan Huang
Cheng Han
Liqiang Li
Wenping Hu
author_facet Jinbo He
Jinjian Yan
Tao Xue
Liqian Yuan
Yongxu Hu
Zhongwu Wang
Xiaosong Chen
Yinan Huang
Cheng Han
Liqiang Li
Wenping Hu
author_sort Jinbo He
collection DOAJ
description ABSTRACT Two‐dimensional (2D) materials, such as MoS2, show exceptional potential for next‐generation electronics. However, the poor stability of these materials, particularly under long‐term operations and high temperature, impedes their practical applications. Here, we develop a terminal passivation interface decoupling (TPID) strategy to significantly improve the stability of MoS2, by mitigating the interaction between the substrate and the 2D material within the in‐situ growth process. Specifically, the strong electron‐withdrawing terminal group hydroxyl, prevalent on the oxide substrate, is passivated by carbon groups. Due to this, the structure of MoS2 materials remains stable during long‐term storage, and its electronic devices, field‐effect transistors (FETs), show remarkable operational and high‐temperature (400°C) stability over 60 days, with much‐improved performance. For example, mobility increases from 9.69 to 85 cm2/(V·s), the highest value for bottom‐up transfer‐free single crystal MoS2 FETs. This work provides a new avenue to solve reliability issues of 2D materials and devices, laying a foundation for their applications in the electronic industry.
format Article
id doaj-art-a6f57c8f9fb34c4fb7d53363757c3694
institution OA Journals
issn 2688-819X
language English
publishDate 2025-04-01
publisher Wiley
record_format Article
series SmartMat
spelling doaj-art-a6f57c8f9fb34c4fb7d53363757c36942025-08-20T02:30:06ZengWileySmartMat2688-819X2025-04-0162n/an/a10.1002/smm2.1318Terminal Passivation–Induced Interface Decoupling for High‐Stability Two‐Dimensional SemiconductorsJinbo He0Jinjian Yan1Tao Xue2Liqian Yuan3Yongxu Hu4Zhongwu Wang5Xiaosong Chen6Yinan Huang7Cheng Han8Liqiang Li9Wenping Hu10Institute of Molecular Aggregation Science, School of Science, Tianjin Key Laboratory of Molecular Optoelectronic Sciences Tianjin University Tianjin ChinaCollege of Physical Science and Technology Xiamen University Xiamen ChinaCenter for Analysis and Tests Tianjin University Tianjin ChinaInstitute of Molecular Aggregation Science, School of Science, Tianjin Key Laboratory of Molecular Optoelectronic Sciences Tianjin University Tianjin ChinaInstitute of Molecular Aggregation Science, School of Science, Tianjin Key Laboratory of Molecular Optoelectronic Sciences Tianjin University Tianjin ChinaInstitute of Molecular Aggregation Science, School of Science, Tianjin Key Laboratory of Molecular Optoelectronic Sciences Tianjin University Tianjin ChinaInstitute of Molecular Aggregation Science, School of Science, Tianjin Key Laboratory of Molecular Optoelectronic Sciences Tianjin University Tianjin ChinaInstitute of Molecular Aggregation Science, School of Science, Tianjin Key Laboratory of Molecular Optoelectronic Sciences Tianjin University Tianjin ChinaSZU‐NUS Collaborative Innovation Center for Optoelectronic Science and Technology International Collaborative Laboratory of 2D Materials for Optoelectronics Science and Technology of Ministry of Education Institute of Microscale Optoelectronics Shenzhen University Shenzhen ChinaInstitute of Molecular Aggregation Science, School of Science, Tianjin Key Laboratory of Molecular Optoelectronic Sciences Tianjin University Tianjin ChinaInstitute of Molecular Aggregation Science, School of Science, Tianjin Key Laboratory of Molecular Optoelectronic Sciences Tianjin University Tianjin ChinaABSTRACT Two‐dimensional (2D) materials, such as MoS2, show exceptional potential for next‐generation electronics. However, the poor stability of these materials, particularly under long‐term operations and high temperature, impedes their practical applications. Here, we develop a terminal passivation interface decoupling (TPID) strategy to significantly improve the stability of MoS2, by mitigating the interaction between the substrate and the 2D material within the in‐situ growth process. Specifically, the strong electron‐withdrawing terminal group hydroxyl, prevalent on the oxide substrate, is passivated by carbon groups. Due to this, the structure of MoS2 materials remains stable during long‐term storage, and its electronic devices, field‐effect transistors (FETs), show remarkable operational and high‐temperature (400°C) stability over 60 days, with much‐improved performance. For example, mobility increases from 9.69 to 85 cm2/(V·s), the highest value for bottom‐up transfer‐free single crystal MoS2 FETs. This work provides a new avenue to solve reliability issues of 2D materials and devices, laying a foundation for their applications in the electronic industry.https://doi.org/10.1002/smm2.13182D materialshigh temperatureinterface decouplingstabilityterminal passivationtransistors
spellingShingle Jinbo He
Jinjian Yan
Tao Xue
Liqian Yuan
Yongxu Hu
Zhongwu Wang
Xiaosong Chen
Yinan Huang
Cheng Han
Liqiang Li
Wenping Hu
Terminal Passivation–Induced Interface Decoupling for High‐Stability Two‐Dimensional Semiconductors
SmartMat
2D materials
high temperature
interface decoupling
stability
terminal passivation
transistors
title Terminal Passivation–Induced Interface Decoupling for High‐Stability Two‐Dimensional Semiconductors
title_full Terminal Passivation–Induced Interface Decoupling for High‐Stability Two‐Dimensional Semiconductors
title_fullStr Terminal Passivation–Induced Interface Decoupling for High‐Stability Two‐Dimensional Semiconductors
title_full_unstemmed Terminal Passivation–Induced Interface Decoupling for High‐Stability Two‐Dimensional Semiconductors
title_short Terminal Passivation–Induced Interface Decoupling for High‐Stability Two‐Dimensional Semiconductors
title_sort terminal passivation induced interface decoupling for high stability two dimensional semiconductors
topic 2D materials
high temperature
interface decoupling
stability
terminal passivation
transistors
url https://doi.org/10.1002/smm2.1318
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