Thermomigration of non-oriented aluminium-rich liquid zones through (110) silicon wafers

The paper analyzes the reasons and factors that allow avoiding faceting of non-oriented linear zones. It is shown that in the manufacture of semiconductor chips with a large perimeter and a reverse voltage of 2000 V, the conditions sine qua non to create isolating walls on silicon wafers with an ori...

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Main Authors: Оlекsіі Polukhin, Vitalii Kravchina
Format: Article
Language:English
Published: Politehperiodika 2021-12-01
Series:Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
Subjects:
Online Access:https://tkea.com.ua/index.php/journal/article/view/70
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author Оlекsіі Polukhin
Vitalii Kravchina
author_facet Оlекsіі Polukhin
Vitalii Kravchina
author_sort Оlекsіі Polukhin
collection DOAJ
description The paper analyzes the reasons and factors that allow avoiding faceting of non-oriented linear zones. It is shown that in the manufacture of semiconductor chips with a large perimeter and a reverse voltage of 2000 V, the conditions sine qua non to create isolating walls on silicon wafers with an orientation different from (111) are to form an ensemble of linear zones by the method of high-temperature selective forced wetting (HSV) and to fulfill a number of requirements to the “thermomigration” photomask and zones immersion stage during TM at high temperatures. It is shown that these factors provide a stable migration of an ensemble of linear zones through wafers (110) even in a stationary temperature gradient field. For the first time in the world, the authors practically demonstrate the possibility of stable migration of an ensemble of non-oriented linear zones through silicon (110) in a stationary temperature gradient conditions, outlining the conditions and factors necessary for this process. It is assumed that when the conditions for the formation of linear zones and their immersion are met, the crystallographic orientation of the silicon wafers does not matter at all.
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id doaj-art-a3e8dcf9d6f84ce0b0ae771e98364460
institution OA Journals
issn 2225-5818
2309-9992
language English
publishDate 2021-12-01
publisher Politehperiodika
record_format Article
series Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
spelling doaj-art-a3e8dcf9d6f84ce0b0ae771e983644602025-08-20T02:09:35ZengPolitehperiodikaTekhnologiya i Konstruirovanie v Elektronnoi Apparature2225-58182309-99922021-12-015–6334010.15222/TKEA2021.5-6.3370Thermomigration of non-oriented aluminium-rich liquid zones through (110) silicon wafersОlекsіі Polukhin0Vitalii Kravchina1Element-Preobrazovatel, LtdMykolaiv Polytechnic Vocational CollegeThe paper analyzes the reasons and factors that allow avoiding faceting of non-oriented linear zones. It is shown that in the manufacture of semiconductor chips with a large perimeter and a reverse voltage of 2000 V, the conditions sine qua non to create isolating walls on silicon wafers with an orientation different from (111) are to form an ensemble of linear zones by the method of high-temperature selective forced wetting (HSV) and to fulfill a number of requirements to the “thermomigration” photomask and zones immersion stage during TM at high temperatures. It is shown that these factors provide a stable migration of an ensemble of linear zones through wafers (110) even in a stationary temperature gradient field. For the first time in the world, the authors practically demonstrate the possibility of stable migration of an ensemble of non-oriented linear zones through silicon (110) in a stationary temperature gradient conditions, outlining the conditions and factors necessary for this process. It is assumed that when the conditions for the formation of linear zones and their immersion are met, the crystallographic orientation of the silicon wafers does not matter at all.https://tkea.com.ua/index.php/journal/article/view/70temperature gradientthrough insulationliquid linear zones al sipower semiconductor devicesthermomigration
spellingShingle Оlекsіі Polukhin
Vitalii Kravchina
Thermomigration of non-oriented aluminium-rich liquid zones through (110) silicon wafers
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
temperature gradient
through insulation
liquid linear zones al si
power semiconductor devices
thermomigration
title Thermomigration of non-oriented aluminium-rich liquid zones through (110) silicon wafers
title_full Thermomigration of non-oriented aluminium-rich liquid zones through (110) silicon wafers
title_fullStr Thermomigration of non-oriented aluminium-rich liquid zones through (110) silicon wafers
title_full_unstemmed Thermomigration of non-oriented aluminium-rich liquid zones through (110) silicon wafers
title_short Thermomigration of non-oriented aluminium-rich liquid zones through (110) silicon wafers
title_sort thermomigration of non oriented aluminium rich liquid zones through 110 silicon wafers
topic temperature gradient
through insulation
liquid linear zones al si
power semiconductor devices
thermomigration
url https://tkea.com.ua/index.php/journal/article/view/70
work_keys_str_mv AT oleksíípolukhin thermomigrationofnonorientedaluminiumrichliquidzonesthrough110siliconwafers
AT vitaliikravchina thermomigrationofnonorientedaluminiumrichliquidzonesthrough110siliconwafers