Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces
The increasing demand for high cooling performance and low power consumption in microchips has driven research toward microchannel heat sinks. Previous studies have explored attaching pin fins with conventional shapes, such as square pin fins, to increase surface area for enhanced cooling. However,...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-02-01
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| Series: | Case Studies in Thermal Engineering |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X25000334 |
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| author | Ahmed Raafat Moza Alteneiji Mohamed Kamra Saeed Al Nuaimi |
| author_facet | Ahmed Raafat Moza Alteneiji Mohamed Kamra Saeed Al Nuaimi |
| author_sort | Ahmed Raafat |
| collection | DOAJ |
| description | The increasing demand for high cooling performance and low power consumption in microchips has driven research toward microchannel heat sinks. Previous studies have explored attaching pin fins with conventional shapes, such as square pin fins, to increase surface area for enhanced cooling. However, this approach often comes at the cost of higher pressure drop and reduced efficiency. In this work, triply periodic minimal surfaces are investigated as pin fins for microchannels. These structures offer a high surface area-to-volume ratio, targeting high Nusselt numbers, while their porous-like topology reduces channel blockage, achieving balanced hydrothermal performance. A numerically validated model, supported by experimental data from literature, is employed to study and analyze three lattice based pin-fin designs, namely: the IWP pin fin, Hybrid A pin fin, and Hybrid B pin fin. The results show that the novel hybrid designs, which combine both square pin fins and the I-graph wrapped package-graph (IWP) lattice at their core, achieve a 54% reduction in pressure drop without compromising thermal performance, as indicated by average Nusselt numbers and maximum temperatures, compared to conventional square pins. Additionally, a 27% improvement in thermal efficiency was observed. This comprehensive study demonstrates the influence of triply periodic minimal surface structures on generating secondary cooling flows and disrupting thermal boundary layers. Finally, the findings encourage further exploration of other lattices, such as Gyroid and Diamond structures, which are expected to exhibit similar trends. |
| format | Article |
| id | doaj-art-a06f79f15c764825a8e6d7f5d0e6eecc |
| institution | Kabale University |
| issn | 2214-157X |
| language | English |
| publishDate | 2025-02-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Case Studies in Thermal Engineering |
| spelling | doaj-art-a06f79f15c764825a8e6d7f5d0e6eecc2025-02-02T05:27:25ZengElsevierCase Studies in Thermal Engineering2214-157X2025-02-0166105773Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfacesAhmed Raafat0Moza Alteneiji1Mohamed Kamra2Saeed Al Nuaimi3Mechanical & Aerospace Engineering, United Arab Emirates University, Al Ain, United Arab EmiratesMechanical & Aerospace Engineering, United Arab Emirates University, Al Ain, United Arab EmiratesMechanical & Aerospace Engineering, United Arab Emirates University, Al Ain, United Arab EmiratesCorresponding author.; Mechanical & Aerospace Engineering, United Arab Emirates University, Al Ain, United Arab EmiratesThe increasing demand for high cooling performance and low power consumption in microchips has driven research toward microchannel heat sinks. Previous studies have explored attaching pin fins with conventional shapes, such as square pin fins, to increase surface area for enhanced cooling. However, this approach often comes at the cost of higher pressure drop and reduced efficiency. In this work, triply periodic minimal surfaces are investigated as pin fins for microchannels. These structures offer a high surface area-to-volume ratio, targeting high Nusselt numbers, while their porous-like topology reduces channel blockage, achieving balanced hydrothermal performance. A numerically validated model, supported by experimental data from literature, is employed to study and analyze three lattice based pin-fin designs, namely: the IWP pin fin, Hybrid A pin fin, and Hybrid B pin fin. The results show that the novel hybrid designs, which combine both square pin fins and the I-graph wrapped package-graph (IWP) lattice at their core, achieve a 54% reduction in pressure drop without compromising thermal performance, as indicated by average Nusselt numbers and maximum temperatures, compared to conventional square pins. Additionally, a 27% improvement in thermal efficiency was observed. This comprehensive study demonstrates the influence of triply periodic minimal surface structures on generating secondary cooling flows and disrupting thermal boundary layers. Finally, the findings encourage further exploration of other lattices, such as Gyroid and Diamond structures, which are expected to exhibit similar trends.http://www.sciencedirect.com/science/article/pii/S2214157X25000334TPMSMicrochannelHeat sinkPin-finHeat transferMicrochip cooling |
| spellingShingle | Ahmed Raafat Moza Alteneiji Mohamed Kamra Saeed Al Nuaimi Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces Case Studies in Thermal Engineering TPMS Microchannel Heat sink Pin-fin Heat transfer Microchip cooling |
| title | Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces |
| title_full | Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces |
| title_fullStr | Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces |
| title_full_unstemmed | Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces |
| title_short | Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces |
| title_sort | hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces |
| topic | TPMS Microchannel Heat sink Pin-fin Heat transfer Microchip cooling |
| url | http://www.sciencedirect.com/science/article/pii/S2214157X25000334 |
| work_keys_str_mv | AT ahmedraafat hydrothermalperformanceofmicrochannelheatsinkintegratingpinfinsbasedontriplyperiodicminimalsurfaces AT mozaalteneiji hydrothermalperformanceofmicrochannelheatsinkintegratingpinfinsbasedontriplyperiodicminimalsurfaces AT mohamedkamra hydrothermalperformanceofmicrochannelheatsinkintegratingpinfinsbasedontriplyperiodicminimalsurfaces AT saeedalnuaimi hydrothermalperformanceofmicrochannelheatsinkintegratingpinfinsbasedontriplyperiodicminimalsurfaces |