Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces
The increasing demand for high cooling performance and low power consumption in microchips has driven research toward microchannel heat sinks. Previous studies have explored attaching pin fins with conventional shapes, such as square pin fins, to increase surface area for enhanced cooling. However,...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-02-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X25000334 |
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