3D periodic microscale structures on binary copper-nickel alloys via fs-DLIP: impact on E. coli-substrate interaction

3D periodic microscale structures on binary copper-nickel alloys via fs-DLIP: impact on E. coli-substrate interaction

In response to the rise of multidrug-resistant infections, researchers are increasingly focusing on modifying material surfaces through chemical or topographical changes to limit microbial spread. Copper and its alloys are particularly valued for their antimicrobial properties, playing a key role in...

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Bibliographic Details
Main Authors: Aisha Saddiqa Ahmed, Sebastian Wältermann, Pablo María Delfino, Daniel Wyn Müller, Jean–Nicolas Audinot, Jean-François Pierson, Frank Mücklich
Format: Article
Language:English
Published: Elsevier 2025-10-01
Series:Materials & Design
Subjects:
Femtosecond
Direct laser interference patterning
Copper-nickel alloy
Antibacterial
Periodic three-dimensional structures
Line-like structures
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127525009657
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