Structural optimization and thermal performance analysis of minichannel heat Sinks: A numerical approach
The development characteristics of modern electronic devices with high integration and high heat flow density make their heat dissipation demand and difficulty increase continuously, and the traditional heat dissipation methods are difficult to meet the heat dissipation demand of high heat flow chip...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-08-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X25006604 |
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