Reliability Prediction of Mixed-Signal Module Based on Multi-Stress Field Failure Mechanisms
The communication module is crucial for control systems. Under thermal, electrical, and mechanical stresses, sensitive digital and analog components may degrade in performance or fail, compromising the module’s long-term stability. Existing reliability-prediction methods, however, do not fully lever...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/15/8/4356 |
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