An analytical review on interfacial reactions in high-temperature die-attach: the insights into the effect of surface metallization and filler materials
This review provides a comprehensive analysis of interfacial reactions and the impact of surface metallization in high-temperature die-attach, which is critical for ensuring the reliability of interconnects and joints in power electronic module packaging and integration. With the emergence of high-t...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2025-01-01
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| Series: | Manufacturing Review |
| Subjects: | |
| Online Access: | https://mfr.edp-open.org/articles/mfreview/full_html/2025/01/mfreview240061/mfreview240061.html |
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