Process Optimization of Plasma Etching on the Size Reduction of Polystyrene Microspheres
The inductively coupled plasma (ICP) etching technique，along with polystyrene (PS) microspheres as masks for etching technology，has been widely applied in the fabrication of silicon nanoarrays.However，the size reduction process of PS microspheres during etching is often accompanied by surface qualit...
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| Main Author: | |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Materials Protection
2025-07-01
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| Series: | Cailiao Baohu |
| Subjects: | |
| Online Access: | http://www.mat-pro.com/fileup/1001-1560/PDF/20250705.pdf |
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