Amorphous-like TiN Films as Barrier Layers for Copper

Amorphous-like TiN Films as Barrier Layers for Copper

The titanium nitride (TiN) columnar structure results in a rapid diffusion of copper atoms into the substrate along a vertical path. In this paper, the TiN columnar growth process was modified, which resulted in the deposition of amorphous-like films. The amorphous-like TiN layer demonstrated a low...

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Bibliographic Details
Main Authors: Shicheng Han, Shicheng Yang, Xiaohong Zeng, Ying Wu, Tong Liu, Hu Wang, Sunan Ding
Format: Article
Language:English
Published: MDPI AG 2024-10-01
Series:Crystals
Subjects:
metallization
diffusion
amorphous-like
titanium nitride
barrier
Online Access:https://www.mdpi.com/2073-4352/14/11/951
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