Series-Fed Microstrip Patch Antenna Array with Additive-Manufactured Foldable Honeycomb-Shaped Substrate
This paper presents a novel foldable S-band microstrip patch antenna array operating in the 2.4–2.45 GHz band. The substrate is designed to allow the array to be folded and arranged in tiles, forming a versatile, reconfigurable antenna array. Additive manufacturing is used to fabricate the substrate...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-11-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/15/12/1449 |
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