A high-performance nano-copper paste with good oxidation resistance
Copper nanoparticles (Cu NPs) are promising candidates for next-generation interconnect materials in power electronics due to their excellent electrical and thermal conductivity and low cost. However, their susceptibility to surface oxidation hinders sintering and device integration. In this work, C...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425019635 |
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