Technical Progress and Trend of Interconnection in IGBT Module

All the interconnection technologies of IGBT module from soldering, bonding and pressure contact were introduced respectively, the development status and technical features of the interconnections were analyzed, and development directions of each interconnection technique were summarized.

Saved in:
Bibliographic Details
Main Authors: QINRong-zhen, LIUGuo-you, HUANGJian-wei
Format: Article
Language:zho
Published: Editorial Department of Electric Drive for Locomotives 2013-01-01
Series:机车电传动
Subjects:
Online Access:http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2013.03.001
Tags: Add Tag
No Tags, Be the first to tag this record!