Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition

Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition

Abstract The effect of carbon fibers (Cf) and Ni nanoparticles addition on the melting point, microstructure, shear strength, indentation hardness and indentation creep of SnBi58/Cu solder joints were explored. Composite solder with various Cf percentages (0, 0.02, 0.04 and 0.06 wt.%) and 0.1 wt.% N...

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Bibliographic Details
Main Authors: Xiangxia Kong, Zuchen Liu, Ruipeng Ma, Junjun Zhai, Zhen Pan, Xuemei Li, Fenglian Sun
Format: Article
Language:English
Published: Nature Portfolio 2024-12-01
Series:Scientific Reports
Subjects:
Composite solder joint
Carbon fiber particles
Microstructure
Mechanical properties
Online Access:https://doi.org/10.1038/s41598-024-83905-3
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https://doi.org/10.1038/s41598-024-83905-3

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