Analysis on Crack Mechanism of Passivation Layer in Power Packaging
Passivation crack on the surface of power chip seriously affects the reliability of power devices. In this paper, the mechanism of passivation layer failure was explored by temperature cycling test on D-PAK module. Temperature cycling tests showed that the cracks developed in the passivation film ov...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2021-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.025 |
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