Using Heat‐Cool Processing to Change the Assembly and Photoconductive Properties of Perylene Bisimides

Using Heat‐Cool Processing to Change the Assembly and Photoconductive Properties of Perylene Bisimides

Abstract Thermal processing is widely used in solution‐based coating techniques or to enhance solubility, yet the impact on supramolecular self‐assembly and thin film properties remains largely unexplored. Here, we demonstrate how heating and cooling cycles modulate the self‐assembly of amino acid‐a...

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Bibliographic Details
Main Authors: Rebecca Elaine Ginesi, Fraser John Angus, Marcin Giza, Gregor Norman McKay Macleod, James Doutch, Pablo Docampo, Emily Rose Draper
Format: Article
Language:English
Published: Wiley-VCH 2025-07-01
Series:Advanced Materials Interfaces
Subjects:
perylene bisimides
self‐assembly
heat‐cool
perovskites
Online Access:https://doi.org/10.1002/admi.202500151
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https://doi.org/10.1002/admi.202500151

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