3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application
Cobalt oxide-based in-plane microsupercapacitors (IPMSCs) stand out as a favorable choice for various applications in energy sources for the Internet of Things (IoT) and other microelectronic devices due to their abundant natural resources and high theoretical specific capacitance. However, the low...
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MDPI AG
2024-10-01
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| author | Shunqi Yang Ri Chen Fu Huang Wenxia Wang Igor Zhitomirsky |
| author_facet | Shunqi Yang Ri Chen Fu Huang Wenxia Wang Igor Zhitomirsky |
| author_sort | Shunqi Yang |
| collection | DOAJ |
| description | Cobalt oxide-based in-plane microsupercapacitors (IPMSCs) stand out as a favorable choice for various applications in energy sources for the Internet of Things (IoT) and other microelectronic devices due to their abundant natural resources and high theoretical specific capacitance. However, the low electronic conductivity of cobalt oxide greatly hinders its further application in energy storage devices. Herein, a new manufacturing method of electric discharging machining (EDM), which is simple, safe, efficient, and environment-friendly, has been developed for synthesizing Mo-doped and oxygen-vacancy-enriched Co-CoO (Mo@Co-CoO) integrated microelectrodes for efficiently constructing Mo@Co-CoO IPMSCs with customized structures in a single step for the first time. The Mo@Co-CoO IPMSCs with three loops (IPMSCs3) exhibited a maximum areal capacitance of 30.4 mF cm<sup>−2</sup> at 2 mV s<sup>−1</sup>. Moreover, the Mo@Co-CoO IPMSCs3 showed good capacitive behavior at a super-high scanning rate of 100 V s<sup>−1</sup>, which is around 500–1000 times higher than most reported CoO-based electrodes. It is important to note that the IPMSCs were fabricated using a one-step EDM process without any assistance of other material processing techniques, toxic chemicals, low conductivity binders, exceptional current collectors, and conductive fillers. This novel fabrication method developed in this research opens a new avenue to simplify material synthesis, providing a novel way for realizing intelligent, digital, and green manufacturing of various metal oxide materials, microelectrodes, and microdevices. |
| format | Article |
| id | doaj-art-8e4a23ec20734306894690ad83c8a0e5 |
| institution | DOAJ |
| issn | 2072-666X |
| language | English |
| publishDate | 2024-10-01 |
| publisher | MDPI AG |
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| series | Micromachines |
| spelling | doaj-art-8e4a23ec20734306894690ad83c8a0e52025-08-20T02:48:01ZengMDPI AGMicromachines2072-666X2024-10-011511129410.3390/mi151112943D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor ApplicationShunqi Yang0Ri Chen1Fu Huang2Wenxia Wang3Igor Zhitomirsky4College of Informatics, Huazhong Agricultural University, Wuhan 430070, ChinaDepartment of Mechatronic Engineering, Guangdong Polytechnic Normal University, Guangzhou 510665, ChinaDepartment of Mechatronic Engineering, Guangdong Polytechnic Normal University, Guangzhou 510665, ChinaDepartment of Biomedical and Pharmaceutical Sciences, Guangdong University of Technology, Guangzhou 510006, ChinaSchool of Materials Science and Engineering, McMaster University, Hamilton, ON L8S 4L7, CanadaCobalt oxide-based in-plane microsupercapacitors (IPMSCs) stand out as a favorable choice for various applications in energy sources for the Internet of Things (IoT) and other microelectronic devices due to their abundant natural resources and high theoretical specific capacitance. However, the low electronic conductivity of cobalt oxide greatly hinders its further application in energy storage devices. Herein, a new manufacturing method of electric discharging machining (EDM), which is simple, safe, efficient, and environment-friendly, has been developed for synthesizing Mo-doped and oxygen-vacancy-enriched Co-CoO (Mo@Co-CoO) integrated microelectrodes for efficiently constructing Mo@Co-CoO IPMSCs with customized structures in a single step for the first time. The Mo@Co-CoO IPMSCs with three loops (IPMSCs3) exhibited a maximum areal capacitance of 30.4 mF cm<sup>−2</sup> at 2 mV s<sup>−1</sup>. Moreover, the Mo@Co-CoO IPMSCs3 showed good capacitive behavior at a super-high scanning rate of 100 V s<sup>−1</sup>, which is around 500–1000 times higher than most reported CoO-based electrodes. It is important to note that the IPMSCs were fabricated using a one-step EDM process without any assistance of other material processing techniques, toxic chemicals, low conductivity binders, exceptional current collectors, and conductive fillers. This novel fabrication method developed in this research opens a new avenue to simplify material synthesis, providing a novel way for realizing intelligent, digital, and green manufacturing of various metal oxide materials, microelectrodes, and microdevices.https://www.mdpi.com/2072-666X/15/11/1294cobalt oxidein-plane microsupercapacitorselectric discharging machiningintegrated microelectrodesMo@Co-CoO |
| spellingShingle | Shunqi Yang Ri Chen Fu Huang Wenxia Wang Igor Zhitomirsky 3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application Micromachines cobalt oxide in-plane microsupercapacitors electric discharging machining integrated microelectrodes Mo@Co-CoO |
| title | 3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application |
| title_full | 3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application |
| title_fullStr | 3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application |
| title_full_unstemmed | 3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application |
| title_short | 3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application |
| title_sort | 3d binder free mo coo electrodes directly manufactured in one step via electric discharge machining for in plane microsupercapacitor application |
| topic | cobalt oxide in-plane microsupercapacitors electric discharging machining integrated microelectrodes Mo@Co-CoO |
| url | https://www.mdpi.com/2072-666X/15/11/1294 |
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