3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application

3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor Application

Cobalt oxide-based in-plane microsupercapacitors (IPMSCs) stand out as a favorable choice for various applications in energy sources for the Internet of Things (IoT) and other microelectronic devices due to their abundant natural resources and high theoretical specific capacitance. However, the low...

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Bibliographic Details
Main Authors: Shunqi Yang, Ri Chen, Fu Huang, Wenxia Wang, Igor Zhitomirsky
Format: Article
Language:English
Published: MDPI AG 2024-10-01
Series:Micromachines
Subjects:
cobalt oxide
in-plane microsupercapacitors
electric discharging machining
integrated microelectrodes
Mo@Co-CoO
Online Access:https://www.mdpi.com/2072-666X/15/11/1294
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