Influence of ni addition on microstructure and solidification behaviour of sac305 lead-free solders
This study investigates the addition of Ni into SAC305 solder alloy with varying nickel content (0–4 wt.% Ni) using experimental techniques and computational thermodynamics. The experimental part employed various techniques (scanning electron microscopy, X-ray diffraction, energy-dispersive X-ray sp...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Serbian Academic Center
2025-06-01
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| Series: | Applied Engineering Letters |
| Subjects: | |
| Online Access: | https://aeletters.com/vol10-no2-4/ |
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