Contrastive Learning with Global and Local Representation for Mixed-Type Wafer Defect Recognition
Recognizing defect patterns in semiconductor wafer bin maps (WBMs) poses a critical challenge in the integrated circuit (IC) manufacturing industry. The accurate classification and segmentation of these defect patterns are of utmost significance as they are key to tracing the root causes of defects,...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-02-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/25/4/1272 |
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