Residual stress and deformation analysis considering adhesive material properties to enhance manufacturing of HBM
Residual stress and deformation in dies and wafers pose significant challenges in high-bandwidth memory (HBM) manufacturing. Precise die alignment is critical for multi-stacked dies in HBM packages, which utilize ultra-fine pitch interconnections. The adhesive used in the HBM process plays a crucial...
Saved in:
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425020125 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|