Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses
In this study, the roughness effects of an Ajinomoto build-up film (ABF) on the crystallographic microstructure and corrosion characteristics of electroplated Cu were systematically investigated via scanning electron microscopy (SEM) in conjunction with electron backscatter diffraction (EBSD), trans...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425006106 |
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