Effect of Solder Voids on IGBT Thermal and Stress Performance
Solder void is one of the important reasons for the heat diffusion badness and fatigue failure of IGBT module. A 3-D finite model was established for IGBT package configuration with considering the influence of die’s field ring area. It studied the effect of solder thickness, void percentage and voi...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2014-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2014.01.015 |
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| Summary: | Solder void is one of the important reasons for the heat diffusion badness and fatigue failure of IGBT module. A 3-D finite model was established for IGBT package configuration with considering the influence of die’s field ring area. It studied the effect of solder thickness, void percentage and void position on maximum temperature and equivalent stress, and analyzed the effect of void percentage on transient thermal impedance. |
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| ISSN: | 2096-5427 |