Effect of Solder Voids on IGBT Thermal and Stress Performance
Solder void is one of the important reasons for the heat diffusion badness and fatigue failure of IGBT module. A 3-D finite model was established for IGBT package configuration with considering the influence of die’s field ring area. It studied the effect of solder thickness, void percentage and voi...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2014-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2014.01.015 |
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