Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Abstract The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was investigated in detail. Based on the mixed lubrication...

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Bibliographic Details
Main Authors: Lei Xu, Kihong Park, Hong Lei, Pengzhan Liu, Eungchul Kim, Yeongkwang Cho, Taesung Kim, Chuandong Chen
Format: Article
Language:English
Published: Tsinghua University Press 2023-03-01
Series:Friction
Subjects:
micro-nano bubbles
mixed lubrication
material removal mechanism
chemical mechanical polishing (CMP)
modeling
Online Access:https://doi.org/10.1007/s40544-022-0668-8
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https://doi.org/10.1007/s40544-022-0668-8

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