Round and pleated blisters: interface delamination in thin film deposition
Electron beam deposition is widely used in microelectronics manufacturing due to its ability to fabricate high-purity thin films at elevated rates. However, the formation of blisters during this process – resulting from delamination between the film and substrate – can compromise film integrity and...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2025-04-01
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| Series: | International Journal of Smart and Nano Materials |
| Subjects: | |
| Online Access: | https://www.tandfonline.com/doi/10.1080/19475411.2025.2493663 |
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