Ultra‐Tough Copper–Copper Bonding by Nano‐Oxide‐Dispersed Copper Nanomembranes

Ultra‐Tough Copper–Copper Bonding by Nano‐Oxide‐Dispersed Copper Nanomembranes

Abstract Metal–metal bonding has played a pivotal role in advancing human technologies across various industrial sectors. As devices continue to miniaturize, there is an increasing need for efficient bonding techniques capable of achieving metal–metal bonds at smaller length scales. In this study, a...

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Bibliographic Details
Main Authors: Yun Teng, Wenqing Zhu, Qing Wang, Zhibo Zhang, Hang Wang, Baisong Guo, Ziyin Yang, Hao Gong, Chuan He, Boxi Qu, Shien‐Ping Feng, Yong Yang
Format: Article
Language:English
Published: Wiley 2025-04-01
Series:Advanced Science
Subjects:
copper nanomembranes
copper oxides
interfacial toughness
metal–metal bonding
strength‐ductility trade‐off
Online Access:https://doi.org/10.1002/advs.202408302
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https://doi.org/10.1002/advs.202408302

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