Hsu, M., Chen, C., Chang, H., & Chen, K. Achieving low-temperature Cu–Cu bonding platform via area-selective metal films with superior surface roughness for advanced packaging. Elsevier.
Chicago Style (17th ed.) CitationHsu, Mu-Ping, Chi-Yu Chen, Hsin-Chi Chang, and Kuan-Neng Chen. Achieving Low-temperature Cu–Cu Bonding Platform via Area-selective Metal Films with Superior Surface Roughness for Advanced Packaging. Elsevier.
MLA (9th ed.) CitationHsu, Mu-Ping, et al. Achieving Low-temperature Cu–Cu Bonding Platform via Area-selective Metal Films with Superior Surface Roughness for Advanced Packaging. Elsevier.
Warning: These citations may not always be 100% accurate.