Achieving low-temperature Cu–Cu bonding platform via area-selective metal films with superior surface roughness for advanced packaging
This study addresses the critical challenge of achieving low-temperature Cu–Cu bonding for advanced packaging applications by optimizing area-selective electroless Au passivation. We demonstrate that an Ar/N2 plasma pretreatment, applied prior to Au deposition, substantially strips oxides, renders t...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425011950 |
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