Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C)
This study investigates Cu single-sided solder joints using hybrid soldering (In + Sn58Bi) at reflow temperatures ranging from 80 to 130 °C. The wetting angles of 27° at 90 °C and 22° at 130 °C demonstrated good wettability. The hybrid solders were composed of γ-In(Sn, Bi) and Bi(In, Sn)2 phases, fo...
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| Format: | Article |
| Language: | English |
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Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424023780 |
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| author | Yu-An Shen |
| author_facet | Yu-An Shen |
| author_sort | Yu-An Shen |
| collection | DOAJ |
| description | This study investigates Cu single-sided solder joints using hybrid soldering (In + Sn58Bi) at reflow temperatures ranging from 80 to 130 °C. The wetting angles of 27° at 90 °C and 22° at 130 °C demonstrated good wettability. The hybrid solders were composed of γ-In(Sn, Bi) and Bi(In, Sn)2 phases, forming Cu6(In, Sn)5 interfacial intermetallic compounds (IMCs). Thermodynamic calculations proved that the hybrid soldering possessed a low liquid temperature of 86.8 ° C, making it suitable for low-temperature applications. The hybrid solders demonstrated notable mechanical performance, with microhardness values exceeding 10 HV—higher than Sn–52In solder (6 HV). Sandwich hybrid-solder joints, reflowed at 90 and 130 ° C, outperformed Sn–52In soldering strength (30.1 and 35.5 MPa) by over 135% and 175%. Additionally, the hybrid solder contains only 41.9 wt% In, lower than Sn–52In, reducing material costs. This study reveals the hybrid solder system offers a promising low-cost and good-strength solution for low-temperature soldering applications. |
| format | Article |
| id | doaj-art-739435889ccc4220a9bb3ab9dc5111cf |
| institution | OA Journals |
| issn | 2238-7854 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-739435889ccc4220a9bb3ab9dc5111cf2025-08-20T02:38:59ZengElsevierJournal of Materials Research and Technology2238-78542024-11-01334473448010.1016/j.jmrt.2024.10.108Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C)Yu-An Shen0No. 100, Wenhwa Rd., Seatwen, Taichung, 40724, Taiwan.; Department of Materials Science and Engineering, Feng Chia University, Taichung, 407, TaiwanThis study investigates Cu single-sided solder joints using hybrid soldering (In + Sn58Bi) at reflow temperatures ranging from 80 to 130 °C. The wetting angles of 27° at 90 °C and 22° at 130 °C demonstrated good wettability. The hybrid solders were composed of γ-In(Sn, Bi) and Bi(In, Sn)2 phases, forming Cu6(In, Sn)5 interfacial intermetallic compounds (IMCs). Thermodynamic calculations proved that the hybrid soldering possessed a low liquid temperature of 86.8 ° C, making it suitable for low-temperature applications. The hybrid solders demonstrated notable mechanical performance, with microhardness values exceeding 10 HV—higher than Sn–52In solder (6 HV). Sandwich hybrid-solder joints, reflowed at 90 and 130 ° C, outperformed Sn–52In soldering strength (30.1 and 35.5 MPa) by over 135% and 175%. Additionally, the hybrid solder contains only 41.9 wt% In, lower than Sn–52In, reducing material costs. This study reveals the hybrid solder system offers a promising low-cost and good-strength solution for low-temperature soldering applications.http://www.sciencedirect.com/science/article/pii/S2238785424023780 |
| spellingShingle | Yu-An Shen Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C) Journal of Materials Research and Technology |
| title | Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C) |
| title_full | Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C) |
| title_fullStr | Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C) |
| title_full_unstemmed | Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C) |
| title_short | Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C) |
| title_sort | cu cu joint with great strength using in sn 58bi hybrid soldering at low temperature 90 °c |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424023780 |
| work_keys_str_mv | AT yuanshen cucujointwithgreatstrengthusinginsn58bihybridsolderingatlowtemperature90c |