Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C)
This study investigates Cu single-sided solder joints using hybrid soldering (In + Sn58Bi) at reflow temperatures ranging from 80 to 130 °C. The wetting angles of 27° at 90 °C and 22° at 130 °C demonstrated good wettability. The hybrid solders were composed of γ-In(Sn, Bi) and Bi(In, Sn)2 phases, fo...
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| Main Author: | |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424023780 |
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