Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C)
This study investigates Cu single-sided solder joints using hybrid soldering (In + Sn58Bi) at reflow temperatures ranging from 80 to 130 °C. The wetting angles of 27° at 90 °C and 22° at 130 °C demonstrated good wettability. The hybrid solders were composed of γ-In(Sn, Bi) and Bi(In, Sn)2 phases, fo...
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| Main Author: | |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424023780 |
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| Summary: | This study investigates Cu single-sided solder joints using hybrid soldering (In + Sn58Bi) at reflow temperatures ranging from 80 to 130 °C. The wetting angles of 27° at 90 °C and 22° at 130 °C demonstrated good wettability. The hybrid solders were composed of γ-In(Sn, Bi) and Bi(In, Sn)2 phases, forming Cu6(In, Sn)5 interfacial intermetallic compounds (IMCs). Thermodynamic calculations proved that the hybrid soldering possessed a low liquid temperature of 86.8 ° C, making it suitable for low-temperature applications. The hybrid solders demonstrated notable mechanical performance, with microhardness values exceeding 10 HV—higher than Sn–52In solder (6 HV). Sandwich hybrid-solder joints, reflowed at 90 and 130 ° C, outperformed Sn–52In soldering strength (30.1 and 35.5 MPa) by over 135% and 175%. Additionally, the hybrid solder contains only 41.9 wt% In, lower than Sn–52In, reducing material costs. This study reveals the hybrid solder system offers a promising low-cost and good-strength solution for low-temperature soldering applications. |
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| ISSN: | 2238-7854 |