Shen, Y. Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C). Elsevier.
Chicago Style (17th ed.) CitationShen, Yu-An. Cu–Cu Joint with Great Strength Using In/Sn–58Bi Hybrid Soldering at Low Temperature (90 °C). Elsevier.
MLA (9th ed.) CitationShen, Yu-An. Cu–Cu Joint with Great Strength Using In/Sn–58Bi Hybrid Soldering at Low Temperature (90 °C). Elsevier.
Warning: These citations may not always be 100% accurate.