Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer
Inductive power transfer (IPT) magnetics are often “potted” with an encapsulant material to improve thermal performance. Mismatched thermal expansion of the encapsulation and magnetic core materials creates a residual mechanical stress that permanently reduces the magnetic perf...
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| Main Authors: | Alexander K. Bailey, Willsen Wijaya, Seho Kim, Jerry Sun, Tom Allen, Grant A. Covic |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
|
| Series: | IEEE Open Journal of Power Electronics |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/11060834/ |
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