Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer

Inductive power transfer (IPT) magnetics are often “potted” with an encapsulant material to improve thermal performance. Mismatched thermal expansion of the encapsulation and magnetic core materials creates a residual mechanical stress that permanently reduces the magnetic perf...

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Bibliographic Details
Main Authors: Alexander K. Bailey, Willsen Wijaya, Seho Kim, Jerry Sun, Tom Allen, Grant A. Covic
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Open Journal of Power Electronics
Subjects:
Online Access:https://ieeexplore.ieee.org/document/11060834/
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