Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer
Inductive power transfer (IPT) magnetics are often “potted” with an encapsulant material to improve thermal performance. Mismatched thermal expansion of the encapsulation and magnetic core materials creates a residual mechanical stress that permanently reduces the magnetic perf...
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| Format: | Article |
| Language: | English |
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IEEE
2025-01-01
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| Series: | IEEE Open Journal of Power Electronics |
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| Online Access: | https://ieeexplore.ieee.org/document/11060834/ |
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| author | Alexander K. Bailey Willsen Wijaya Seho Kim Jerry Sun Tom Allen Grant A. Covic |
| author_facet | Alexander K. Bailey Willsen Wijaya Seho Kim Jerry Sun Tom Allen Grant A. Covic |
| author_sort | Alexander K. Bailey |
| collection | DOAJ |
| description | Inductive power transfer (IPT) magnetics are often “potted” with an encapsulant material to improve thermal performance. Mismatched thermal expansion of the encapsulation and magnetic core materials creates a residual mechanical stress that permanently reduces the magnetic performance of the Mn–Zn ferrite core layer. An encapsulated small-scale Double-D IPT pad designed for <inline-formula><tex-math notation="LaTeX">$\mathrm{2.5}$</tex-math></inline-formula> <inline-formula><tex-math notation="LaTeX">$\mathrm{kW}$</tex-math></inline-formula> is built and tested, and the core loss of the ferrite tiles increases by <inline-formula><tex-math notation="LaTeX">$\mathrm{121}$</tex-math></inline-formula>% after encapsulation with a polyurethane-based material. The change in the core loss of the potted IPT pad after encapsulation is predicted using finite element analysis, and the proposed method matches within <inline-formula><tex-math notation="LaTeX">$\mathrm{7.3}$</tex-math></inline-formula>% . Three methods are presented to mitigate this increase in losses and experimentally verified on ferrite toroids. These results show that the choice of encapsulation material significantly impacts the thermal, structural, and electromagnetic behavior of the IPT pad. |
| format | Article |
| id | doaj-art-6eb28cc3a7124187a5b2e2e9c4b84572 |
| institution | DOAJ |
| issn | 2644-1314 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Open Journal of Power Electronics |
| spelling | doaj-art-6eb28cc3a7124187a5b2e2e9c4b845722025-08-20T02:40:47ZengIEEEIEEE Open Journal of Power Electronics2644-13142025-01-0161215122410.1109/OJPEL.2025.358475311060834Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power TransferAlexander K. Bailey0https://orcid.org/0009-0002-6131-8648Willsen Wijaya1Seho Kim2https://orcid.org/0000-0002-8396-5902Jerry Sun3Tom Allen4Grant A. Covic5https://orcid.org/0000-0002-4480-7370Department of Electrical, Computer and Software Engineering, The University of Auckland, Auckland, New ZealandCentre for Advanced Materials Manufacturing and Design, The University of Auckland, Auckland, New ZealandDepartment of Electrical, Computer and Software Engineering, The University of Auckland, Auckland, New ZealandCentre for Advanced Materials Manufacturing and Design, The University of Auckland, Auckland, New ZealandCentre for Advanced Materials Manufacturing and Design, The University of Auckland, Auckland, New ZealandDepartment of Electrical, Computer and Software Engineering, The University of Auckland, Auckland, New ZealandInductive power transfer (IPT) magnetics are often “potted” with an encapsulant material to improve thermal performance. Mismatched thermal expansion of the encapsulation and magnetic core materials creates a residual mechanical stress that permanently reduces the magnetic performance of the Mn–Zn ferrite core layer. An encapsulated small-scale Double-D IPT pad designed for <inline-formula><tex-math notation="LaTeX">$\mathrm{2.5}$</tex-math></inline-formula> <inline-formula><tex-math notation="LaTeX">$\mathrm{kW}$</tex-math></inline-formula> is built and tested, and the core loss of the ferrite tiles increases by <inline-formula><tex-math notation="LaTeX">$\mathrm{121}$</tex-math></inline-formula>% after encapsulation with a polyurethane-based material. The change in the core loss of the potted IPT pad after encapsulation is predicted using finite element analysis, and the proposed method matches within <inline-formula><tex-math notation="LaTeX">$\mathrm{7.3}$</tex-math></inline-formula>% . Three methods are presented to mitigate this increase in losses and experimentally verified on ferrite toroids. These results show that the choice of encapsulation material significantly impacts the thermal, structural, and electromagnetic behavior of the IPT pad.https://ieeexplore.ieee.org/document/11060834/Core lossinductive power transfer (IPT)loss measurementmagnetic losses |
| spellingShingle | Alexander K. Bailey Willsen Wijaya Seho Kim Jerry Sun Tom Allen Grant A. Covic Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer IEEE Open Journal of Power Electronics Core loss inductive power transfer (IPT) loss measurement magnetic losses |
| title | Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer |
| title_full | Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer |
| title_fullStr | Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer |
| title_full_unstemmed | Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer |
| title_short | Impact of Encapsulation on the Core Loss of Ferrites in Inductive Power Transfer |
| title_sort | impact of encapsulation on the core loss of ferrites in inductive power transfer |
| topic | Core loss inductive power transfer (IPT) loss measurement magnetic losses |
| url | https://ieeexplore.ieee.org/document/11060834/ |
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