Review of Active Thermal Control for Power Electronics: Potentials, Limitations, and Future Trends
The main factor that drives the aging of power semiconductor modules is the thermally induced stress caused by the maximum temperature and temperature swings. This thermally induced stress is usually counteracted in passive designs with oversizing of components, which brings additional cost to the s...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Open Journal of Power Electronics |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10470388/ |
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