Spatial Decoupling Method for a Novel Dual-Orthogonal Induction MEMS Three-Dimensional Electric Field Sensor
To mitigate the three-dimensional (3D) coupling interference of electric field sensors, a novel MEMS 3D electric field sensor with a dual-orthogonal induction structure and its spatial decoupling method is proposed. The sensor is designed with a cylindrical structure, in which two pairs of induction...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-03-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/4/381 |
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