Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy
This study mainly focuses on the effects of different Ni content in Sn–Ag–Cu–Ni solder alloys on their electrochemical corrosion behavior and solderability. The results demonstrate that the addition of nickel significantly refines β-Sn grains, promotes the formation of the intermetallic compound (Cu...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425009408 |
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| author | Ziheng Zhao Xuan Liu Luntao Wang Jialiang Song Xianqin Zhuo Yao Tan Hao Zhang Heqian Wang Junsheng Wu Kui Xiao |
| author_facet | Ziheng Zhao Xuan Liu Luntao Wang Jialiang Song Xianqin Zhuo Yao Tan Hao Zhang Heqian Wang Junsheng Wu Kui Xiao |
| author_sort | Ziheng Zhao |
| collection | DOAJ |
| description | This study mainly focuses on the effects of different Ni content in Sn–Ag–Cu–Ni solder alloys on their electrochemical corrosion behavior and solderability. The results demonstrate that the addition of nickel significantly refines β-Sn grains, promotes the formation of the intermetallic compound (Cu,Ni)6Sn5 by partially substituting the Cu6Sn5 phase, and inhibits the lamellar growth of coarse Ag3Sn, thereby enhancing microstructural homogeneity. By combining electrochemical techniques with in-situ Raman spectroscopy, the role of nickel in influencing the composition and passivation behavior of corrosion products was elucidated. At low nickel contents (0.05–0.1 wt%), the formation of dense Sn(IV) oxide films reduces the passivation current density, inhibits chloride ion penetration, and decreases the depth of corrosion pits (from 21.4 μm to 15.7 μm). In contrast, higher nickel contents (0.25–0.5 wt%) exacerbate intergranular corrosion due to enhanced galvanic coupling between the nickel-rich (Cu,Ni)6Sn5 phase and the β-Sn matrix. Moreover, the formation of porous passivation films composed of Sn(OH)4 and Sn–Cl complexes leads to local film breakdown and promotes pitting propagation. Differential scanning calorimetry results indicate that while nickel has a negligible effect on the melting point of the alloy, it reduces the degree of solidification supercooling (from 14.7 °C to 11.5 °C), thereby improving solidification stability. |
| format | Article |
| id | doaj-art-65759e329cf044baaa4ebc21845392a7 |
| institution | OA Journals |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-65759e329cf044baaa4ebc21845392a72025-08-20T02:25:01ZengElsevierJournal of Materials Research and Technology2238-78542025-05-01364999501010.1016/j.jmrt.2025.04.119Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloyZiheng Zhao0Xuan Liu1Luntao Wang2Jialiang Song3Xianqin Zhuo4Yao Tan5Hao Zhang6Heqian Wang7Junsheng Wu8Kui Xiao9Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, ChinaXiaMen Golden Egret Special Alloy Co., Ltd., XiaMen, 361007, ChinaInstitute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China; Corresponding author.Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, ChinaHainan International Commercial Aerospace Launch Co., Ltd., Wenchang, 571300, ChinaInstitute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, ChinaInstitute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, ChinaInstitute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, ChinaInstitute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China; China National Electric Apparatus Research Institute Co., Ltd. National Key Laboratory of Environmental Adaptability for Industrial Products, Guangzhou, 510663, ChinaInstitute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China; China National Electric Apparatus Research Institute Co., Ltd. National Key Laboratory of Environmental Adaptability for Industrial Products, Guangzhou, 510663, China; Corresponding author. Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China.This study mainly focuses on the effects of different Ni content in Sn–Ag–Cu–Ni solder alloys on their electrochemical corrosion behavior and solderability. The results demonstrate that the addition of nickel significantly refines β-Sn grains, promotes the formation of the intermetallic compound (Cu,Ni)6Sn5 by partially substituting the Cu6Sn5 phase, and inhibits the lamellar growth of coarse Ag3Sn, thereby enhancing microstructural homogeneity. By combining electrochemical techniques with in-situ Raman spectroscopy, the role of nickel in influencing the composition and passivation behavior of corrosion products was elucidated. At low nickel contents (0.05–0.1 wt%), the formation of dense Sn(IV) oxide films reduces the passivation current density, inhibits chloride ion penetration, and decreases the depth of corrosion pits (from 21.4 μm to 15.7 μm). In contrast, higher nickel contents (0.25–0.5 wt%) exacerbate intergranular corrosion due to enhanced galvanic coupling between the nickel-rich (Cu,Ni)6Sn5 phase and the β-Sn matrix. Moreover, the formation of porous passivation films composed of Sn(OH)4 and Sn–Cl complexes leads to local film breakdown and promotes pitting propagation. Differential scanning calorimetry results indicate that while nickel has a negligible effect on the melting point of the alloy, it reduces the degree of solidification supercooling (from 14.7 °C to 11.5 °C), thereby improving solidification stability.http://www.sciencedirect.com/science/article/pii/S2238785425009408SnAgCuNi alloyLead-free solderElectrochemical corrosionSolderability |
| spellingShingle | Ziheng Zhao Xuan Liu Luntao Wang Jialiang Song Xianqin Zhuo Yao Tan Hao Zhang Heqian Wang Junsheng Wu Kui Xiao Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy Journal of Materials Research and Technology SnAgCuNi alloy Lead-free solder Electrochemical corrosion Solderability |
| title | Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy |
| title_full | Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy |
| title_fullStr | Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy |
| title_full_unstemmed | Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy |
| title_short | Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy |
| title_sort | study on the electrochemical corrosion behavior and solderability of snagcuni solder alloy |
| topic | SnAgCuNi alloy Lead-free solder Electrochemical corrosion Solderability |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425009408 |
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