Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy

Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy

This study mainly focuses on the effects of different Ni content in Sn–Ag–Cu–Ni solder alloys on their electrochemical corrosion behavior and solderability. The results demonstrate that the addition of nickel significantly refines β-Sn grains, promotes the formation of the intermetallic compound (Cu...

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Bibliographic Details
Main Authors: Ziheng Zhao, Xuan Liu, Luntao Wang, Jialiang Song, Xianqin Zhuo, Yao Tan, Hao Zhang, Heqian Wang, Junsheng Wu, Kui Xiao
Format: Article
Language:English
Published: Elsevier 2025-05-01
Series:Journal of Materials Research and Technology
Subjects:
SnAgCuNi alloy
Lead-free solder
Electrochemical corrosion
Solderability
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785425009408
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