Research on the mechanical and thermal properties of potting adhesive with different fillers of h-BN and MPCM
Using packaging materials to reduce contact thermal resistance has become a promising method to solve the problem of insufficient heat dissipation capacity of electronic components. The purpose of this work is to optimize the mechanical and thermodynamic performance of potting adhesive using phase c...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-12-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X24015417 |
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