Recent Applications of Focused Ion Beam–Scanning Electron Microscopy in Advanced Packaging
Advanced packaging represents a crucial technological evolution aimed at overcoming limitations posed by Moore’s Law, driving the semiconductor industry from two-dimensional toward three-dimensional integrated structures. The increasing complexity and miniaturization of electronic devices have signi...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-05-01
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| Series: | Journal of Manufacturing and Materials Processing |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-4494/9/5/158 |
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