Flip-chip package solder-underfill reliability using finite element analysis
A semiconductor package is responsible to safeguard the die from the external environment that can affect its performance and reliability. A flip-chip package ensures that the assembly, which is capable of high input-output function, maintains its operation and safeguards the interconnection paths p...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-12-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123024017997 |
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