Research on the influence of epoxy resin on the service life of bond wire in power devices
Power cycling test is the most important test to evaluate the package reliability of power semiconductor devices. Bonding wire failure accounts for approximately 70% of power cycle failure modes. It has been proved that the TO (Transistor Outline) device packaged with epoxy resin has a power cycle l...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2023-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.009 |
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