In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal Cycling
Related to microelectronics’ reliability, lifetime estimation methods have gained importance, especially for surface-mounted devices. The virtual testing of electronic assemblies necessitates the geometry modeling and finite element analysis of the solder joint. The effect of the simplification of t...
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| Format: | Article |
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MDPI AG
2024-11-01
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| Series: | Applied Mechanics |
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| Online Access: | https://www.mdpi.com/2673-3161/5/4/49 |
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| author | Antal Bakonyi Gusztáv Fekete Ambrus Zelei |
| author_facet | Antal Bakonyi Gusztáv Fekete Ambrus Zelei |
| author_sort | Antal Bakonyi |
| collection | DOAJ |
| description | Related to microelectronics’ reliability, lifetime estimation methods have gained importance, especially for surface-mounted devices. The virtual testing of electronic assemblies necessitates the geometry modeling and finite element analysis of the solder joint. The effect of the simplification of the solder geometry on the predicted lifetime is an open question. Furthermore, there is still not yet straightforward guidance for the choice of the material model and fatigue lifetime model. In this study, the impact of the geometry input method, the material model and the lifetime model choice is investigated on two different surface-mounted capacitors in a simulation-based benchmark analysis under thermal cyclic loading. Four different types of solder geometry modeling approaches are compared, among which one is a physics-based approach. Ten different fatigue models founded on plastic and viscoplastic material models are benchmarked. The results show that the component standoff height and the solder volume have a positive effect on the lifetime, while the capacitor size has a slightly negative effect on the lifetime. The results also suggest that approximate geometries can be used to replace the physics-based model with a restriction for the minimum standoff height. |
| format | Article |
| id | doaj-art-5fc8798b334b4684910efbd654fab6e1 |
| institution | DOAJ |
| issn | 2673-3161 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Applied Mechanics |
| spelling | doaj-art-5fc8798b334b4684910efbd654fab6e12025-08-20T02:50:52ZengMDPI AGApplied Mechanics2673-31612024-11-015487790710.3390/applmech5040049In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal CyclingAntal Bakonyi0Gusztáv Fekete1Ambrus Zelei2Department of Whole Vehicle Engineering, Audi Hungaria Faculty of Vehicle Engineering, Széchenyi István University, h-9026 Győr, HungaryDepartment of Material Science and Technology, Audi Hungaria Faculty of Vehicle Engineering, Széchenyi István University, h-9026 Győr, HungaryDepartment of Whole Vehicle Engineering, Audi Hungaria Faculty of Vehicle Engineering, Széchenyi István University, h-9026 Győr, HungaryRelated to microelectronics’ reliability, lifetime estimation methods have gained importance, especially for surface-mounted devices. The virtual testing of electronic assemblies necessitates the geometry modeling and finite element analysis of the solder joint. The effect of the simplification of the solder geometry on the predicted lifetime is an open question. Furthermore, there is still not yet straightforward guidance for the choice of the material model and fatigue lifetime model. In this study, the impact of the geometry input method, the material model and the lifetime model choice is investigated on two different surface-mounted capacitors in a simulation-based benchmark analysis under thermal cyclic loading. Four different types of solder geometry modeling approaches are compared, among which one is a physics-based approach. Ten different fatigue models founded on plastic and viscoplastic material models are benchmarked. The results show that the component standoff height and the solder volume have a positive effect on the lifetime, while the capacitor size has a slightly negative effect on the lifetime. The results also suggest that approximate geometries can be used to replace the physics-based model with a restriction for the minimum standoff height.https://www.mdpi.com/2673-3161/5/4/49solder joint thermal fatigue lifesurface-mounted devicesviscoplastic material modelsolder geometrysimulation benchmark |
| spellingShingle | Antal Bakonyi Gusztáv Fekete Ambrus Zelei In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal Cycling Applied Mechanics solder joint thermal fatigue life surface-mounted devices viscoplastic material model solder geometry simulation benchmark |
| title | In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal Cycling |
| title_full | In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal Cycling |
| title_fullStr | In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal Cycling |
| title_full_unstemmed | In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal Cycling |
| title_short | In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal Cycling |
| title_sort | in silico benchmarking of fatigue life estimation models for passive smd solder joints under thermal cycling |
| topic | solder joint thermal fatigue life surface-mounted devices viscoplastic material model solder geometry simulation benchmark |
| url | https://www.mdpi.com/2673-3161/5/4/49 |
| work_keys_str_mv | AT antalbakonyi insilicobenchmarkingoffatiguelifeestimationmodelsforpassivesmdsolderjointsunderthermalcycling AT gusztavfekete insilicobenchmarkingoffatiguelifeestimationmodelsforpassivesmdsolderjointsunderthermalcycling AT ambruszelei insilicobenchmarkingoffatiguelifeestimationmodelsforpassivesmdsolderjointsunderthermalcycling |