In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal Cycling
Related to microelectronics’ reliability, lifetime estimation methods have gained importance, especially for surface-mounted devices. The virtual testing of electronic assemblies necessitates the geometry modeling and finite element analysis of the solder joint. The effect of the simplification of t...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-11-01
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| Series: | Applied Mechanics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-3161/5/4/49 |
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