Research of the Cutting Technology on Silicon Wafer by YAG Laser
Cutting technology on silicon wafer by YAG laser is experimentally investigated. Influences of laser power, cutting velocity, assistant gas and fatal point on the final cutting quality are analyzed. Suggestions and methods of improvement for the subsistent problems are further proposed, which provid...
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| Main Author: | |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2010-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2010.03.012 |
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