Effect of the Configuration and Shape of External Ribs of Sealed Enclosures of Electronic Devices on Heat Removal Efficiency
Introduction. Modern computing and electronic devices are constructed on the basis of radio-electronic components, such as processors, graphics processing units, etc. During operation, these components emit tens of watts of thermal energy. Therefore, effective excess heat removal from both semicondu...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | Russian |
| Published: |
Saint Petersburg Electrotechnical University "LETI"
2023-11-01
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| Series: | Известия высших учебных заведений России: Радиоэлектроника |
| Subjects: | |
| Online Access: | https://re.eltech.ru/jour/article/view/800 |
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